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| NCP9002 1.3 Watt Audio Power Amplifier with Fast Turn On Time The NCP9002 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP9002 is capable of delivering 1.3 W of continuous average power to an 8.0 W BTL load from a 5.0 V power supply, and 1.0 W to a 4.0 W BTL load from a 3.6 V power supply. The NCP9002 provides high quality audio while requiring few external components and minimal power consumption. It features a low-power consumption shutdown mode, which is achieved by driving the SHUTDOWN pin with logic low. The NCP9002 contains circuitry to prevent from "pop and click" noise that would otherwise occur during turn-on and turn-off transitions. For maximum flexibility, the NCP9002 provides an externally controlled gain (with resistors), as well as an externally controlled turn-on time (with the bypass capacitor). When using a 1 mF bypass capacitor, it offers 100 ms wake up time. Due to its excellent PSRR, it can be directly connected to the battery, saving the use of an LDO. This device is available in a 9-Pin Flip-Chip CSP (Lead-Free). Features http://onsemi.com MARKING DIAGRAMS 9-Pin Flip-Chip CSP FC SUFFIX CASE 499AL A3 A1 MAZG AYWW A1 C1 MAZ A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package PIN CONNECTIONS 9-Pin Flip-Chip CSP A1 INM B1 VM_P C1 BYPASS A2 OUTA B2 VM C2 A3 INP B3 Vp C3 * * * * * * * * * * 1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply Excellent PSRR: Direct Connection to the Battery "Pop and Click" Noise Protection Circuit Ultra Low Current Shutdown Mode: 10 nA 2.2 V-5.5 V Operation External Gain Configuration Capability External Turn-on Time Configuration Capability: 100 ms (1 mF Bypass Capacitor) Up to 1.0 nF Capacitive Load Driving Capability Thermal Overload Protection Circuitry This is a Pb-Free Device OUTB SHUTDOWN (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. Typical Applications * Portable Electronic Devices * PDAs * Wireless Phones (c) Semiconductor Components Industries, LLC, 2006 1 December, 2006 - Rev. 4 Publication Order Number: NCP9002/D NCP9002 Rf 20 kW Cs Ci 47 nF Ri 20 kW Vp 1 mF AUDIO INPUT INM INP Vp - + Vp OUTA R1 20 kW R2 20 kW OUTB 8W BYPASS Cbypass 1 mF SHUTDOWN VIH VIL VM_P - + SHUTDOWN CONTROL VM Figure 1. Typical Audio Amplifier Application Circuit with Single Ended Input Rf 20 kW Cs Ci + 47 nF AUDIO INPUT - 47 nF 20 kW 20 kW Cbypass Rf BYPASS 1 mF SHUTDOWN VIH VIL VM_P SHUTDOWN CONTROL VM - + Ci 20 kW Ri Vp INM INP - + Vp OUTA R1 20 kW R2 20 kW OUTB Ri Vp 1 mF 8W Figure 2. Typical Audio Amplifier Application Circuit with a Differential Input This device contains 671 active transistors and 1899 MOS gates. http://onsemi.com 2 NCP9002 PIN DESCRIPTION Pin A1 A2 A3 B1 B2 B3 C1 C2 C3 Type I O I I I I I O I Symbol INM OUTA INP VM_P VM Vp BYPASS OUTB SHUTDOWN Description Negative input of the first amplifier, receives the audio input signal. Connected to the feedback resistor Rf and to the input resistor Rin. Negative output of the NCP9002. Connected to the load and to the feedback resistor Rf. Positive input of the first amplifier, receives the common mode voltage. Power Analog Ground. Core Analog Ground. Positive analog supply of the cell. Range: 2.2 V-5.5 V. Bypass capacitor pin which provides the common mode voltage (Vp/2). Positive output of the NCP9002. Connected to the load. The device enters in shutdown mode when a low level is applied on this pin. MAXIMUM RATINGS (Note 1) Rating Supply Voltage Operating Supply Voltage Input Voltage Max Output Current Power Dissipation (Note 2) Operating Ambient Temperature Max Junction Temperature Storage Temperature Range Thermal Resistance Junction-to-Air ESD Protection Human Body Model (HBM) (Note 4) Machine Model (MM) (Note 5) Symbol Vp Op Vp Vin Iout Pd TA TJ Tstg RqJA - - Value 6.0 2.2 to 5.5 V 2.0 V = Functional Only -0.3 to Vcc +0.3 500 Internally Limited -40 to +85 150 -65 to +150 (Note 3) 6000 >250 100 Unit V - V mA - C C C C/W V mA Latchup Current at TA = 85C (Note 6) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25C. 2. The thermal shutdown set to 160C (typical) avoids irreversible damage on the device due to power dissipation. For further information see page 9. 3. The RqJA is highly dependent of the PCB Heatsink area. For example, RqJA can equal 195C/W with 50 mm2 total area and also 135C/W with 500 mm2. For further information see page 10. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation. 4. Human Body Model, 100 pF discharge through a 1.5 kW resistor following specification JESD22/A114. 5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115. 6. Maximum ratings per JEDEC standard JESD78. http://onsemi.com 3 NCP9002 ELECTRICAL CHARACTERISTICS Limits apply for TA between -40C to +85C (Unless otherwise noted). Characteristic Supply Quiescent Current Symbol Idd Conditions Vp = 2.6 V, No Load Vp = 5.0 V, No Load Vp = 2.6 V, 8 W Vp = 5.0 V, 8 W Common Mode Voltage Shutdown Current Shutdown Voltage High Shutdown Voltage Low Turning On Time (Note 9) Turning Off Time Output Impedance in Shutdown Mode Output Swing Vcm ISD VSDIH VSDIL TWU TOFF ZSD Vloadpeak - TA = +25C TA = -40C to +85C - - Cby = 1 mF - - Vp = 2.6 V, RL = 8.0 W Vp = 5.0 V, RL = 8.0 W (Note 8) TA = +25C TA = -40C to +85C Vp = 2.6 V, RL = 4.0 W THD + N < 0.1% Vp = 2.6 V, RL = 8.0 W THD + N < 0.1% Vp = 5.0 V, RL = 8.0 W THD + N < 0.1% Vp = 5.0 V, RL = 8.0 W Vp = 2.6 V Vp = 5.0 V Vp = 2.6 V, G = 2.0 10 Hz < F < 20 kHz Vp = 5.0 V, G = 10 10 Hz < F < 20 kHz G = 2.0, RL = 8.0 W Vpripple_pp = 200 mV Cby = 1.0 mF Input Terminated with 10 W F = 217 Hz Vp = 5.0 V Vp = 3.0 V Vp = 2.6 V F = 1.0 kHz Vp = 5.0 V Vp = 3.0 V Vp = 2.6 V Efficiency Thermal Shutdown Temperature (Note 10) Total Harmonic Distortion h Tsd THD Vp = 2.6, F = 1.0 kHz RL = 4.0 W, AV = 2.0 PO = 0.32 W Vp = 5.0 V, F = 1.0 kHz RL = 8.0 W, AV = 2.0 PO = 1.0 W 7. Min/Max limits are guaranteed by design, test or statistical analysis. 8. This parameter is guaranteed but not tested in production in case of a 5.0 V power supply. 9. See page 11 for a theoretical approach of this parameter. 10. For this parameter, the Min/Max values are given for information. Vp = 2.6 V, Porms = 320 mW Vp = 5.0 V, Porms = 1.0 W Min (Note 7) - - - - - - 1.2 - - - - 1.6 4.0 3.85 - Typ 1.5 1.7 1.7 1.9 Vp/2 0.01 - - 90 1.0 10 2.20 4.50 0.40 0.30 - 1.20 - -30 - - 84 77 - 0.65 30 - - dB W mV dB - - W Max (Note 7) 4 5.5 - 0.5 1.0 - 0.4 - - - - - V mA V V ms ms kW V Unit mA Rms Output Power PO Maximum Power Dissipation (Note 9) Output Offset Voltage Signal-to-Noise Ratio PDmax VOS SNR Positive Supply Rejection Ratio PSRR V+ - - - -64 -72 -73 - - - - - - - - 140 - - - - - - -64 -74 -75 48 63 160 - 0.04 - - 0.02 - - - - - - 180 - - - - - - % C % http://onsemi.com 4 NCP9002 TYPICAL PERFORMANCE CHARACTERISTICS 10 Vp = 2.5 V RL = 8 W f = 1 kHz AV = 2 10 Vp = 3.2 V RL = 8 W f = 1 kHz AV = 2 1 THD + N (%) 1 THD + N (%) 0.1 0.1 0.01 0.01 0.001 0 50 100 150 200 250 300 350 400 Pout, POWER OUT (mW) 0.001 0 100 200 300 400 500 600 700 Pout, POWER OUT (mW) Figure 3. THD + N versus Power Out Figure 4. THD + N versus Power Out 10 Vp = 3.6 V RL = 8 W f = 1 kHz AV = 2 10 Vp = 4.2 V RL = 8 W f = 1 kHz AV = 2 1 THD + N (%) 1 THD + N (%) 300 400 500 600 700 800 0.1 0.1 0.01 0.01 0.001 0 100 200 Pout, POWER OUT (mW) 0.001 0 200 400 600 800 1000 1200 Pout, POWER OUT (mW) Figure 5. THD + N versus Power Out Figure 6. THD + N versus Power Out 10 Vp = 5 V RL = 8 W f = 1 kHz AV = 2 10 Vp = 3.6 V RL = 4 W f = 1 kHz AV = 2 1 THD + N (%) 1 THD + N (%) 600 800 1000 1200 1400 1600 0.1 0.1 0.01 0.01 0.001 0 200 400 Pout, POWER OUT (mW) 0.001 0 200 400 600 800 1000 1200 Pout, POWER OUT (mW) Figure 7. THD + N versus Power Out Figure 8. THD + N versus Power Out http://onsemi.com 5 NCP9002 TYPICAL PERFORMANCE CHARACTERISTICS 1700 1500 OUTPUT POWER (mW) 1300 1100 900 700 500 300 100 2.5 3.0 3.5 4.0 4.5 5.0 0.001 10 100 1000 FREQUENCY (Hz) 10,000 100,000 THD+N < 1% RL = 8 W f = 1 kHz AV = 2 10 Vp = 2.5 V RL = 8 W Pout = 100 mW AV = 2 THD+N < 10% THD + N (%) 1 0.1 0.01 POWER SUPPLY (V) Figure 9. Output Power versus Power Supply Figure 10. THD + N versus Frequency 10 Vp = 3 V RL = 8 W Pout = 150 mW AV = 2 10 Vp = 3.3 V RL = 8 W Pout = 250 mW AV = 2 1 THD + N (%) 1 THD + N (%) 1000 10,000 100,000 0.1 0.1 0.01 0.01 0.001 10 100 FREQUENCY (Hz) 0.001 10 100 1000 FREQUENCY (Hz) 10,000 100,000 Figure 11. THD + N versus Frequency Figure 12. THD + N versus Frequency 10 Vp = 5 V RL = 8 W Pout = 250 mW AV = 2 10 Vp = 2.5 V RL = 4 W Pout = 100 mW AV = 2 1 THD + N (%) 1 THD + N (%) 1000 10,000 100,000 0.1 0.1 0.01 0.01 0.001 10 100 FREQUENCY (Hz) 0.001 10 100 1000 FREQUENCY (Hz) 10,000 100,000 Figure 13. THD + N versus Frequency Figure 14. THD + N versus Frequency http://onsemi.com 6 NCP9002 TYPICAL PERFORMANCE CHARACTERISTICS -10 -20 -30 PSRR (dB) -40 AV = 8 -50 -60 -70 -80 10 100 AV = 2 Vp = 3.6 V RL = 8 W Vripple = 200 mVpk-pk Input to Gnd Cbypass = 1 mF -10 -20 -30 PSRR (dB) -40 AV = 8 -50 -60 -70 10,000 -80 10 100 AV = 2 Vp = 5 V RL = 8 W Vripple = 200 mVpk-pk Input to Gnd Cbypass = 1 mF 1000 1000 10,000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 15. PSRR @ Vp = 3.6 V Single Ended Audio Input to Ground -10 -20 -30 PSRR (dB) -40 AV = 4 -50 -60 -70 -80 10 100 AV = 1 Vp = 3.6 V RL = 8 W Vripple = 200 mVpk-pk Input to Gnd Cbypass = 1 mF -10 -20 -30 PSRR (dB) -40 Figure 16. PSRR @ Vp = 5 V Single Ended Audio Input to Ground Vp = 5 V RL = 8 W Vripple = 200 mVpk-pk Input to Gnd Cbypass = 1 mF AV = 4 -50 -60 AV = 1 -70 1000 10,000 -80 10 100 1000 10,000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 17. PSRR @ Vp = 3.6 V Differential Audio Input to Ground Figure 18. PSRR @ Vp = 5 V Differential Audio Input to Ground -10 -20 -30 PSRR (dB) -40 -50 -60 -70 -80 10 100 1000 10,000 VP = 5 V & VP = 3.6 V RL = 8 W AV = 2 Vripple = 200 mVpk-pk Inputs Floating Cbypass = 1 mF 0 -10 -20 PSRR (dB) -30 -40 -50 -60 -70 -80 -5 -4 -3 -2 -1 0 1 2 3 4 5 Vp = 5 V RL = 8 W F = 217 Hz AV = 2 Vripple = 200 mVpk-pk Cbypass = 1 mF FREQUENCY (Hz) DC OUTPUT VOLTAGE (V) Figure 19. PSRR @ Vp = 3.6 V Single Ended Audio Input Floating Figure 20. PSRR @ DC Output Voltage http://onsemi.com 7 NCP9002 TYPICAL PERFORMANCE CHARACTERISTICS 180 160 140 Turn ON (ms) Turn ON (ms) 120 100 80 60 40 20 0 0 400 800 1200 1600 2000 Cbypass (nF) 60 50 -50 -25 0 25 50 75 100 125 100 90 80 70 Vbat = 2.5 V Vbat = 3.6 V 120 110 Vbat = 5.5 V TEMPERATURE (C) Figure 21. TON versus Cbypass @ Vbat = 3.6 V, TA = +255C 96 PD, POWER DISSIPATION (W) 94 92 Turn ON (ms) 90 88 86 84 82 80 78 76 2.5 3.0 3.5 4.0 Vbat, (V) 4.5 5.0 5.5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Figure 22. TON versus Temperature @ Vbat = 3.6 V, Cbypass = 1 mF Vp = 5 V RL = 8 W F = 1 kHz THD + N < 0.1% 0 0.2 0.4 0.6 0.8 1 1.2 Pout, OUTPUT POWER (W) Figure 23. TON vs. Vbat @ Cbypass = 1 mF, TA = +255C 0.3 PD, POWER DISSIPATION (W) 0.25 0.2 0.15 0.1 0.05 0 0 0.1 0.2 0.3 0.4 0.5 Pout, OUTPUT POWER (W) Vp = 3.3 V RL = 8 W F = 1 kHz THD + N < 0.1% PD, POWER DISSIPATION (W) 0.25 Figure 24. Power Dissipation versus Output Power 0.2 0.15 Vp = 3 V RL = 8 W F = 1 kHz THD + N < 0.1% 0.1 0.05 0 0 0.1 0.2 0.3 0.4 Pout, OUTPUT POWER (W) Figure 25. Power Dissipation versus Output Power Figure 26. Power Dissipation versus Output Power http://onsemi.com 8 NCP9002 TYPICAL PERFORMANCE CHARACTERISTICS 0.4 PD, POWER DISSIPATION (W) 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 Pout, OUTPUT POWER (W) Vp = 2.6 V F = 1 kHz THD + N < 0.1% RL = 8 W PD, POWER DISSIPATION (mW) RL = 4 W 700 600 200 mm2 500 50 mm2 400 300 200 100 0 0 PDmax = 633 mW for Vp = 5 V, RL = 8 W 20 40 60 80 100 120 140 160 500 mm2 PCB Heatsink Area TA, AMBIENT TEMPERATURE (C) Figure 27. Power Dissipation versus Output Power 180 DIE TEMPERATURE (C) @ AMBIENT TEMPERATURE 25C 160 140 120 100 80 60 40 Vp = 2.6 V 50 100 150 Vp = 4.2 V Figure 28. Power Derating - 9-Pin Flip-Chip CSP Maximum Die Temperature 150C RL = 8 W Vp = 5 V Vp = 3.3 V 200 (mm2) 250 300 PCB HEATSINK AREA Figure 29. Maximum Die Temperature versus PCB Heatsink Area http://onsemi.com 9 NCP9002 TYPICAL PERFORMANCE CHARACTERISTICS Ch1 = OUTA Ch2 = OUTB Ch3 = Shutdown Math1 = Ch1-Ch2: Differential Signal seen by the Load Ch1 = OUTA Ch2 = OUTB Ch3 = Shutdown Math1 = Ch1-Ch2: Differential Signal seen by the Load Figure 30. Zero Pop Noise Turn On Sequence with Differential Input to Ground; Cin = 100 nF, Rin = 24 W, Rf = 100 kW, Cbyp = 1 mF, RL = 8 W Figure 31. Zero Pop Noise Turn On Sequence with Differential Audio Source; Cin = 100 nF, Rin = 24 W, Rf = 100 kW, Cbyp = 1 mF, RL = 8 W Ch1 = OUTA Ch2 = OUTB Ch3 = Shutdown Math1 = Ch1-Ch2: Differential Signal seen by the Load Ch1 = OUTA Ch2 = OUTB Ch3 = Shutdown Math1 = Ch1-Ch2: Differential Signal seen by the Load Figure 32. Zero Pop Noise Turn Off Sequence with Differential Input to Ground; Cin = 100 nF, Rin = 24 W, Rf = 100 kW, Cbyp = 1 mF, RL = 8 W Figure 33. Zero Pop Noise Turn Off Sequence with Differential Audio Source; Cin = 100 nF, Rin = 24 W, Rf = 100 kW, Cbyp = 1 mF, RL = 8 W http://onsemi.com 10 NCP9002 APPLICATION INFORMATION Detailed Description The NCP9002 audio amplifier can operate under 2.6 V until 5.5 V power supply. With less than 1% THD+N, B version can deliver up to 1.2 W rms output power to an 8.0 W load (Vp = 5.0 V). If application allows to reach 10% THD+N, then 1.6 W can be provided using a 5.0 V power supply. The structure of the NCP9002 is basically composed of two identical internal power amplifiers; the first one is externally configurable with gain-setting resistors Rin and Rf (the closed-loop gain is fixed by the ratios of these resistors) and the second is internally fixed in an inverting unity-gain configuration by two resistors of 20 kW. So the load is driven differentially through OUTA and OUTB outputs. This configuration eliminates the need for an output coupling capacitor. The NCP9002 has around 10 kW output impedance in the shutdown mode. Internal Power Amplifier is no audible pop click noise, especially when the input cut off frequency is higher than 100 Hz. Shutdown Function The device enters shutdown mode when shutdown signal is low. During the shutdown mode, the DC quiescent current of the circuit does not exceed 100 nA. In this configuration, the output impedance is 10 kW on each output. Current Limit Circuit The output PMOS and NMOS transistors of the amplifier were designed to deliver the output power of the specifications without clipping. The channel resistance (Ron) of the NMOS and PMOS transistors does not exceed 0.6 W when they drive current. The structure of the internal power amplifier is composed of three symmetrical gain stages, first and medium gain stages are transconductance gain stages to obtain maximum bandwidth and DC gain. Turn-On and Turn-Off Transitions The maximum output power of the circuit (Porms = 1.0 W, Vp = 5.0 V, RL = 8.0 W) requires a peak current in the load of 500 mA. In order to limit the excessive power dissipation in the load when a short-circuit occurs, the current limit in the load is fixed to 800 mA. The current in the four output MOS transistors are real-time controlled, and when one current exceeds 800 mA, the gate voltage of the MOS transistor is clipped and no more current can be delivered. Thermal Overload Protection A cycle with a turn-on and turn-off transition is illustrated with plots that show both single ended signals on the previous page. In order to eliminate "pop and click" noises during transitions, output power in the load must be slowly established or cut. When logic high is applied to the shutdown pin, the bypass voltage begins to rise exponentially and once the output DC level is around the common mode voltage, the gain is established instantaneously. This way to turn-on the device is optimized in terms of rejection of "pop and click" noises. The device has the same behavior when it is turned-off by a logic low on the shutdown pin. During the shutdown mode, amplifier outputs are connected to the ground. When a shutdown low level is applied, with 1 mF bypass capacitor, it takes 65 ms before the DC output level is tied to Ground on each output. However, no audio signal will be provided to the BTL load only 1 ms after the falling edge on the shutdown pin. With 1 mF bypass capacitor, turn on time is set to 90 ms. This fast turn on time added to a very low shutdown current saves battery life and brings flexibility when designing the audio section of the final application. NCP9002 is a zero pop noise device when using a differential audio input. In case of a single ended one, there Internal amplifiers are switched off when the temperature exceeds 160C, and will be switched on again only when the temperature decreases fewer than 140C. The NCP9002 is unity-gain stable and requires no external components besides gain-setting resistors, an input coupling capacitor and a proper bypassing capacitor in the typical application. The first amplifier is externally configurable (Rf and Rin), while the second is fixed in an inverting unity gain configuration. The differential-ended amplifier presents two major advantages: - The possible output power is four times larger (the output swing is doubled) as compared to a single-ended amplifier under the same conditions. - Output pins (OUTA and OUTB) are biased at the same potential Vp/2, this eliminates the need for an output coupling capacitor required with a single-ended amplifier configuration. The differential closed loop-gain of the amplifier is given by Avd + 2 * f + orms . Rin Vinrms Output power delivered to the load is given by Porms + (Vopeak)2 (Vopeak is the peak differential 2 * RL R V output voltage). When choosing gain configuration to obtain the desired output power, check that the amplifier is not current limited or clipped. The maximum current which can be delivered to the load is 500 mA Iopeak + Vopeak . RL http://onsemi.com 11 NCP9002 Gain-Setting Resistor Selection (Rin and Rf) Rin and Rf set the closed-loop gain of the amplifier. In order to optimize device and system performance, the NCP9002 should be used in low gain configurations. The low gain configuration minimizes THD + noise values and maximizes the signal to noise ratio, and the amplifier can still be used without running into the bandwidth limitations. A closed loop gain in the range from 2 to 5 is recommended to optimize overall system performance. An input resistor (Rin) value of 22 kW is realistic in most of applications, and doesn't require the use of a too large capacitor Cin. Input Capacitor Selection (Cin) large input coupling capacitor requires more time to reach its quiescent DC voltage (Vp/2) and can increase the turn-on pops when a single ended audio input is used. An input capacitor value between 33 nF and 220 nF performs well in many applications (With Rin = 22 KW). Bypass Capacitor Selection (Cby) The input coupling capacitor blocks the DC voltage at the amplifier input terminal. This capacitor creates a high-pass filter with Rin, the cut-off frequency is given by fc + 1 . 2 * P * Rin * Cin The bypass capacitor Cby provides half-supply filtering and determines how fast the NCP9002 turns on (see Figure 21). With a differential audio input, the amplifier will be a zero pop noise device no matter the bypass capacitor. With a single ended audio input, this capacitor is a critical component to minimize the turn-on pop. A 1.0 mF bypass capacitor value (Cin = < 0.39 mF) should produce clickless and popless shutdown transitions. The amplifier is still functional with a 0.1 mF capacitor value but is more susceptible to "pop and click" noises. Thus, a 1.0 mF bypassing capacitor is recommended. The size of the capacitor must be large enough to couple in low frequencies without severe attenuation. However a ORDERING INFORMATION Device NCP9002FCT2G Marking MAZ Package 9-Pin Flip-Chip CSP (Pb-Free) Shipping 3000/T ape and Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 12 NCP9002 PACKAGE DIMENSIONS 9-PIN FLIP-CHIP CSP FC SUFFIX CASE 499AL-01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS MIN MAX 0.540 0.660 0.210 0.270 0.330 0.390 1.450 BSC 1.450 BSC 0.290 0.340 0.500 BSC 1.000 BSC 1.000 BSC 4X -A- D -B- E 0.10 C TOP VIEW 0.10 C 0.05 C -C- SEATING PLANE A DIM A A1 A2 D E b e D1 E1 A2 A1 SIDE VIEW D1 e C B e A 9X E1 b 1 2 3 0.05 C A B 0.03 C BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 13 NCP9002/D |
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